ATROX Hybrid Silver Sintering Die Attach

Advanced sinter and solder solutions addressing a wide variety of challenges for power electronics. Our engineered sinter materials are proven to enable high throughput and reliability while providing flexible and easy-to-use form factors that reduce the capital cost and accelerate time to market.

• Good thermal conductivity > 5 W/m-K
• Lower stress material for medium to large size die packages (< 100mm2).
• Low RBO and compatible with multiple leadframe surfaces: Cu & PPF (NiPdAu).

Is a thermosetting conductive die attach adhesive with high thermal conductivity (>100 W/m-K) designed for high power semiconductors and exposed pad semiconductor packages. It has excellent adhesive strength to NiPdAu, Ag and MEP leadframes, low out gassing, which minimizes oven contamination, and is ideal for excellent MSL performance.