Alpha Wave Soldering Flux

A highly active, halide-free, water-soluble organic flux designed to give excellent wetting. Alpha 260-JF can be used in wave soldering process for printed circuit board assemblies and for tinning lead frames and component leads for semiconductor application.

Low solids, no-clean flux with small percentage of rosin and non-halide activators, providing excellent solder wetting for both lead-free and tin-lead soldering

A low solid, no-clean flux specifically designed to eliminate the tendency for solder balling and solder bridging. It exhibits the lowest tendency for solder ball generation over a wide variety of solder masks. It is pin-testable.

A no-clean, alcohol-based flux which contains low rosin, designed to provide excellent solderability and reliability for high-density board and normal board. It is designed to have low bridging on bottom side QFPs. It has superior performance in hole-fill and solder balling. It provides good joint cosmetics with evenly spread, tack-free residue.

A no-clean, low solids flux developed to delivery outstanding board cosmetics and to eliminate tendency for solder balling and solder bridging. IT is suitable for both wave soldering and selective soldering processes.

A high-reliability, IPC, Bellcore, JIS compliant, low solids, no-clean, alcohol-based flux. It was developed to delivery high reliability and excellent soldering performance combined with outstanding board cosmetics and pin-testability. It exhibits a low tendency for solder ball over many varieties of solder masks during wave soldering and selective soldering processes.

A halogen-free, no clean, high reliability, alcohol-based flux designed for both thick and high-density board application and standard board in lead-free process. This flux shows stable performance even under long exposure to higher preheat and higher pot temperature. Alpha EF-8800HF is formulated to have low bridging on bottom side QFPs and superior performance in pin-testing, hole-fill, and solder balling. This flux provides good lead-free solder joint cosmetics with evenly spread, tack free residue.

A halogen-free, no-clean, low-solids, alcohol-based flux for many types of assemblies. It has excellent hold fill on assemblies with high-density components. Alpha EF-6808HF exhibits low bridging, icicles, and solder balls in both lead-free and SnPb process. Flux residues are uniform, transparent, tack-free, and highly pin testable. EF-6808HF is highly reliable and complies with all current Halogen-free industry standard.