Alpha Solder Paste

A zero-halogen solder paste with superior electrochemical performance and minimize residue spread. This results in superior electrochemical performance down to 0.200 mm spacing on harsh automotive profiles. ALPHA OM-353 in combination with the Innolot alloy provide the optimal solution for high reliability applications.

This solder paste is compatible with Type 5 powders for fine feature applications and available with traditional lead-free alloys such as SAC305 or low silver SACX. ALPHA OM-353 combines world class print and reflow performance with consistent transfer efficiency and excellent non-wet open and head-in-pillow performance making this solder paste ideal for broad latitude application.

An excellent all-round no-clean paste with superior pin-testing and Best-In-Class Electrochemical Reliability performance. Lead-free, zero-halogen, no-clean, multi-alloy solder paste designed for high reliability applications. It is suitable for assemblies requiring flexibility across multiple component types. CVP-390 exceeds IPC7905 Class III Voids for soak profile and low voiding on large areas deposits. Compatible with SAC305, Innolot (high reliability alloy), SACX Plus (low Ag) alloys.

A lead-free, a no-clean solder paste designed for a broad range of applications. It provides best-in-class low defect rate for head-in-pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly with ultra-fine feature repeatability and high “throughput” applications.

A lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components. ALPHA OM-358 achieves IPC7095 Class III voiding on BGA components and less than 10% voiding on bottom termination components. This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.

A lead-free, a no-clean, zero-halogen solder paste designed for a broad range of applications and engineered to delivery comparable performance to a tin-lead process. OM-338PT yields excellent print capability performance across various board designs, particularly with ultra-fine features (11 mil squares) and high through-put application. OM-338PT is formulated to offer increased in-circuit pin test yields without compromising electrical reliability.

A no-clean, zero-halogen, low temperature, and high-reliability solder paste with the HRL1 alloy designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys. Reduction of warpage induced defects compared to SAC reflow process. Excellent Non Wet Open (NOW) & Head-in-Pillow (HiP) Performance

A no-clean, zero-halogen low temperature solder paste designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP). Alpha OM-550 (HRL1)

A water-soluble, lead-free, halide-free solder paste with excellent cleanability in a lead-free alloy solder paste. It is able to spread and wet using straight ramp or soak profile in air. Highly cleanable with bath and inline aqueous systems.